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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
40-8320-610C

40-8320-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,064 25.28

立即询盘

40-8320-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8350-610C

40-8350-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,961 25.28

立即询盘

40-8350-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8370-610C

40-8370-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,612 25.28

立即询盘

40-8370-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8435-310C

40-8435-310C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,178 25.28

立即询盘

40-8435-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8460-610C

40-8460-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,054 25.28

立即询盘

40-8460-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8500-610C

40-8500-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,735 25.28

立即询盘

40-8500-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8530-610C

40-8530-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,515 25.28

立即询盘

40-8530-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8600-610C

40-8600-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,371 25.28

立即询盘

40-8600-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8620-610C

40-8620-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,309 25.28

立即询盘

40-8620-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8625-610C

40-8625-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,435 25.28

立即询盘

40-8625-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8650-610C

40-8650-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,248 25.28

立即询盘

40-8650-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8700-310C

40-8700-310C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,933 25.28

立即询盘

40-8700-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8700-610C

40-8700-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,924 25.28

立即询盘

40-8700-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8750-610C

40-8750-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,823 25.28

立即询盘

40-8750-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8770-610C

40-8770-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,340 25.28

立即询盘

40-8770-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8785-310C

40-8785-310C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

2,235 25.28

立即询盘

40-8785-310C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8785-610C

40-8785-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,153 25.28

立即询盘

40-8785-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8800-610C

40-8800-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

1,059 25.28

立即询盘

40-8800-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-8810-610C

40-8810-610C

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,839 25.28

立即询盘

40-8810-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
32-6574-11

32-6574-11

CONN IC DIP SOCKET ZIF 32POS TIN

Aries Electronics

4,844 25.45

立即询盘

32-6574-11

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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