上传BOM单
400-966-0015
sales@cooltat.com.hk
欢迎来到 诺亚方舟半导体（深圳）有限公司
| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
208-PGM17017-10CONN SOCKET PGA GOLD |
2,238 | 24.35 |
立即询盘 |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
85-PGM11008-11CONN SOCKET PGA GOLD |
4,441 | 24.68 |
立即询盘 |
Datasheet |
Bulk | PGM | Active | PGA | - | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
33-0511-11CONN SOCKET SIP 33POS GOLD |
3,901 | 24.72 |
立即询盘 |
Datasheet |
Bulk | 511 | Active | SIP | 33 (1 x 33) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
29-0511-11CONN SOCKET SIP 29POS GOLD |
3,464 | 24.76 |
立即询盘 |
Datasheet |
Bulk | 511 | Active | SIP | 29 (1 x 29) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
48-6508-20CONN IC DIP SOCKET 48POS GOLD |
3,355 | 24.91 |
立即询盘 |
Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
48-6508-30CONN IC DIP SOCKET 48POS GOLD |
2,901 | 24.91 |
立即询盘 |
Datasheet |
Bulk | 508 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
34-0508-21CONN SOCKET SIP 34POS GOLD |
3,438 | 24.95 |
立即询盘 |
Datasheet |
Bulk | 508 | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
34-0508-31CONN SOCKET SIP 34POS GOLD |
3,489 | 24.95 |
立即询盘 |
Datasheet |
Bulk | 508 | Active | SIP | 34 (1 x 34) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
34-1508-21CONN IC DIP SOCKET 34POS GOLD |
3,190 | 24.96 |
立即询盘 |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 34 (2 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
34-1508-31CONN IC DIP SOCKET 34POS GOLD |
4,554 | 24.96 |
立即询盘 |
Datasheet |
Bulk | 508 | Active | DIP, 0.2 (5.08mm) Row Spacing | 34 (2 x 17) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
28-3575-11CONN IC DIP SOCKET ZIF 28POS GLD |
3,745 | 25.21 |
立即询盘 |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
28-6575-11CONN IC DIP SOCKET ZIF 28POS TIN |
3,142 | 25.21 |
立即询盘 |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Beryllium Copper | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
32-3574-11CONN IC DIP SOCKET ZIF 32POS |
3,299 | 25.22 |
立即询盘 |
Datasheet |
Bulk | 57 | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Nickel Boron | 50.0µin (1.27µm) | Beryllium Nickel | Polyphenylene Sulfide (PPS), Glass Filled |
|
|
40-81000-310CCONN IC DIP SOCKET 40POS GOLD |
2,691 | 25.28 |
立即询盘 |
Datasheet |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-81000-610CCONN IC DIP SOCKET 40POS GOLD |
2,741 | 25.28 |
立即询盘 |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-81150-610CCONN IC DIP SOCKET 40POS GOLD |
4,635 | 25.28 |
立即询盘 |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-81250-310CCONN IC DIP SOCKET 40POS GOLD |
1,951 | 25.28 |
立即询盘 |
Datasheet |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-81250-610CCONN IC DIP SOCKET 40POS GOLD |
2,851 | 25.28 |
立即询盘 |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-8260-610CCONN IC DIP SOCKET 40POS GOLD |
3,401 | 25.28 |
立即询盘 |
Datasheet |
Bulk | 8 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
40-8300-310CCONN IC DIP SOCKET 40POS GOLD |
3,453 | 25.28 |
立即询盘 |
Datasheet |
Bulk | 8 | Active | DIP, 0.3 (7.62mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Closed Frame, Elevated | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
Request a Quote
