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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
514-83-478M26-131148CONN SOCKET BGA 478POS GOLD |
4,111 | 52.41 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 478 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-600M35-001148CONN SOCKET BGA 600POS GOLD |
1,348 | 52.58 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 600 (35 x 35) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-480M29-001148CONN SOCKET BGA 480POS GOLD |
1,093 | 52.63 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 480 (29 x 29) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-478M26-131152BGA SOLDER TAIL |
4,421 | 52.86 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | BGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-480M29-001152BGA SOLDER TAIL |
2,869 | 53.08 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | BGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-456M26-001101PGA SOLDER TAIL 1.27MM |
1,884 | 53.34 |
立即询盘 |
Datasheet |
Bulk | 558 | Active | PGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-420M26-001106CONN SOCKET PGA 420POS GOLD |
4,394 | 53.36 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | PGA | 420 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
558-10-432M31-001104BGA SURFACE MOUNT 1.27MM |
2,401 | 53.66 |
立即询盘 |
Datasheet |
Bulk | 558 | Active | BGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
518-77-432M31-001105CONN SOCKET PGA 432POS GOLD |
3,984 | 53.88 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | PGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
546-83-528-21-121147CONN SOCKET PGA 528POS GOLD |
1,064 | 54.45 |
立即询盘 |
Datasheet |
Bulk | 546 | Active | PGA | 528 (21 x 21) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-529-21-121147CONN SOCKET PGA 529POS GOLD |
4,369 | 54.55 |
立即询盘 |
Datasheet |
Bulk | 546 | Active | PGA | 529 (21 x 21) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-545-17-000147CONN SOCKET PGA 545POS GOLD |
1,653 | 54.56 |
立即询盘 |
Datasheet |
Bulk | 546 | Active | PGA | 545 (17 x 17) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-500M30-001148CONN SOCKET BGA 500POS GOLD |
3,894 | 54.83 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 500 (30 x 30) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-432M31-001106CONN SOCKET PGA 432POS GOLD |
3,723 | 54.88 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | PGA | 432 (31 x 31) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-83-504M29-001148CONN SOCKET BGA 504POS GOLD |
3,005 | 55.27 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 504 (29 x 29) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-500M30-001152BGA SOLDER TAIL |
3,228 | 55.29 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | BGA | 500 (30 x 30) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-504M29-001152BGA SOLDER TAIL |
2,123 | 55.73 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | BGA | 504 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-478M26-131101PGA SOLDER TAIL 1.27MM |
3,932 | 55.91 |
立即询盘 |
Datasheet |
Bulk | 558 | Active | PGA | 478 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-480M29-001101PGA SOLDER TAIL 1.27MM |
1,823 | 56.15 |
立即询盘 |
Datasheet |
Bulk | 558 | Active | PGA | 480 (29 x 29) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-456M26-001104BGA SURFACE MOUNT 1.27MM |
4,425 | 56.64 |
立即询盘 |
Datasheet |
Bulk | 558 | Active | BGA | 456 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
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