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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
514-87-478M26-131148CONN SOCKET BGA 478POS GOLD |
1,073 | 41.89 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 478 (26 x 26) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-87-480M29-001148CONN SOCKET BGA 480POS GOLD |
2,888 | 42.06 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 480 (29 x 29) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-360M19-001101PGA SOLDER TAIL 1.27MM |
3,978 | 41.16 |
立即询盘 |
Datasheet |
Bulk | 558 | Active | PGA | 360 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-83-388M26-001148CONN SOCKET BGA 388POS GOLD |
3,785 | 42.55 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 388 (26 x 26) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-528-21-121147CONN SOCKET PGA 528POS GOLD |
3,672 | 42.97 |
立即询盘 |
Datasheet |
Bulk | 546 | Active | PGA | 528 (21 x 21) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-388M26-001152BGA SOLDER TAIL |
1,335 | 42.90 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | BGA | 388 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-87-529-21-121147CONN SOCKET PGA 529POS GOLD |
4,445 | 43.05 |
立即询盘 |
Datasheet |
Bulk | 546 | Active | PGA | 529 (21 x 21) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-87-545-17-000147CONN SOCKET PGA 545POS GOLD |
4,374 | 43.06 |
立即询盘 |
Datasheet |
Bulk | 546 | Active | PGA | 545 (17 x 17) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
546-83-419-19-111147CONN SOCKET PGA 419POS GOLD |
3,535 | 43.21 |
立即询盘 |
Datasheet |
Bulk | 546 | Active | PGA | 419 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-560M33-001166BGA PIN ADAPTER 1.27MM SMD |
3,555 | 43.14 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | BGA | 560 (33 x 33) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
546-83-420-19-111147CONN SOCKET PGA 420POS GOLD |
4,400 | 43.31 |
立即询盘 |
Datasheet |
Bulk | 546 | Active | PGA | 420 (19 x 19) | 0.050 (1.27mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Press-Fit | 0.100 (2.54mm) | Tin | - | Bronze | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-352M26-001104BGA SURFACE MOUNT 1.27MM |
4,596 | 43.72 |
立即询盘 |
Datasheet |
Bulk | 558 | Active | BGA | 352 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
514-87-500M30-001148CONN SOCKET BGA 500POS GOLD |
1,443 | 43.81 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 500 (30 x 30) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
514-83-400M20-000148CONN SOCKET BGA 400POS GOLD |
4,429 | 42.87 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 400 (20 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-296-19-131144CONN SOCKET PGA 296POS GOLD |
4,815 | 43.98 |
立即询盘 |
Datasheet |
Bulk | 614 | Active | PGA | 296 (19 x 19) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
518-77-352M26-001105CONN SOCKET PGA 352POS GOLD |
1,789 | 42.91 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | PGA | 352 (26 x 26) | 0.050 (1.27mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.050 (1.27mm) | Gold | Flash | Brass | FR4 Epoxy Glass |
|
|
514-87-504M29-001148CONN SOCKET BGA 504POS GOLD |
4,896 | 44.16 |
立即询盘 |
Datasheet |
Bulk | 514 | Active | BGA | 504 (29 x 29) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
558-10-356M26-001104BGA SURFACE MOUNT 1.27MM |
2,237 | 44.22 |
立即询盘 |
Datasheet |
Bulk | 558 | Active | BGA | 356 (26 x 26) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
550-10-400M20-000152BGA SOLDER TAIL |
3,498 | 43.23 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | BGA | 400 (20 x 20) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Through Hole | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
|
|
558-10-357M19-001104BGA SURFACE MOUNT 1.27MM |
3,609 | 43.35 |
立即询盘 |
Datasheet |
Bulk | 558 | Active | BGA | 357 (19 x 19) | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Gold | 10.0µin (0.25µm) | Brass | FR4 Epoxy Glass |
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