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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
228-1277-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
2,189 | 25.69 |
立即询盘 |
Datasheet |
Bulk,Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
224-1286-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD |
2,349 | 29.94 |
立即询盘 |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
224-5248-00-0602JCONN IC DIP SOCKET ZIF 24POS GLD |
4,179 | 30.66 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
228-1371-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
4,850 | 36.61 |
立即询盘 |
Datasheet |
Tray | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
240-3639-00-0602JCONN IC DIP SOCKET ZIF 40POS GLD |
2,715 | 42.35 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 1.0 (25.40mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
220-7201-55-1902CONN SOCKET SOIC 20POS GOLD |
2,024 | 42.46 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | SOIC | 20 (2 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
|
264-4493-00-0602JCONN IC DIP SOCKET ZIF 64POS GLD |
4,974 | 56.31 |
立即询盘 |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
248-5205-00CONN SOCKET QFN 48POS GOLD |
1,799 | 98.05 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | QFN | 48 (4 x 12) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
224-5205-01CONN SOCKET QFN 24POS GOLD |
1,073 | 99.26 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | QFN | 24 (4x4) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
228-5204-01CONN SOCKET QFN 28POS GOLD |
2,190 | 102.99 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | QFN | 28 (4 x 7) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
248-5205-01CONN SOCKET QFN 48POS GOLD |
2,558 | 121.22 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | QFN | 48 (4 x 12) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
264-5205-01CONN SOCKET QFN 64POS GOLD |
2,095 | 135.92 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | QFN | 64 (4 x 16) | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.020 (0.50mm) | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
224-5809-00-0602CONN SOCKET SIP ZIF 24POS GOLD |
2,970 | 49.03 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | SIP, ZIF (ZIP) | 24 (1 x 24) | 0.100 (2.54mm) | Gold | - | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
8468-21A1-RK-TPCONN SOCKET PLCC 68POS TIN |
6,525 | 2.60 |
立即询盘 |
Datasheet |
Tube | 8400 | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
232-1285-00-0602JCONN IC DIP SOCKET ZIF 32POS GLD |
2,293 | 25.71 |
立即询盘 |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
228-1290-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
3,457 | 27.12 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
242-1281-00-0602JCONN IC DIP SOCKET ZIF 42POS GLD |
1,408 | 28.10 |
立即询盘 |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
228-4817-00-0602JCONN IC DIP SOCKET ZIF 28POS GLD |
3,670 | 29.53 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
256-1292-00-0602JCONN IC DIP SOCKET ZIF 56POS GLD |
1,127 | 43.58 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing | 56 (2 x 28) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
228-7396-55-1902CONN SOCKET SOIC 28POS GOLD |
1,624 | 46.75 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | SOIC | 28 (2 x 14) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES), Glass Filled |
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