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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
232-5205-01CONN SOCKET QFN 32POS GOLD |
2,291 | 106.59 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | QFN | 32 (4 x 8) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
|
240-5205-01CONN SOCKET QFN 40POS GOLD |
3,088 | 113.04 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Active | QFN | 40 (4 x 10) | - | Gold | - | Beryllium Copper | Through Hole | Closed Frame | Solder | - | Gold | - | Beryllium Copper | Polyethersulfone (PES) |
|
4832-6004-CPCONN IC DIP SOCKET 32POS TIN |
8,462 | 1.09 |
立即询盘 |
Datasheet |
Tube | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
8432-21A1-RK-TPCONN SOCKET PLCC 32POS TIN |
8,571 | 1.84 |
立即询盘 |
Datasheet |
Tube | 8400 | Active | PLCC | 32 (2 x 7, 2 x 9) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
200-6313-9UN-1900CONN SOCKET PGA ZIF 169POS GOLD |
119 | 58.50 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 169 (13 x 13) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) |
|
200-6315-9UN-1900CONN SOCKET PGA ZIF 225POS GOLD |
3,413 | 91.84 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 225 (15 x 15) | 0.100 (2.54mm) | - | - | - | - | - | - | 0.100 (2.54mm) | - | - | - | Polyethersulfone (PES) |
|
200-6319-9UN-1900CONN SOCKET PGA ZIF 361POS GOLD |
125 | 99.54 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 361 (19 x 19) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) |
|
200-6321-9UN-1900CONN SOCKET PGA ZIF 441POS GOLD |
3,519 | 122.25 |
立即询盘 |
Datasheet |
Bulk | Textool™ | Obsolete | PGA, ZIF (ZIP) | 441 (21 x 21) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polyethersulfone (PES) |
|
264-1300-00-0602JCONN IC DIP SOCKET ZIF 64POS GLD |
3,026 | 45.08 |
立即询盘 |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
4824-6004-CPCONN IC DIP SOCKET 24POS TIN |
14,920 | 0.89 |
立即询盘 |
Datasheet |
Tube | 4800 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
4828-3004-CPCONN IC DIP SOCKET 28POS TIN |
11,194 | 0.95 |
立即询盘 |
Datasheet |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
8420-11B1-RK-TPCONN SOCKET PLCC 20POS TIN |
6,197 | 1.58 |
立即询盘 |
Datasheet |
Tube | 8400 | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
8428-21B1-RK-TPCONN SOCKET PLCC 28POS TIN |
8,924 | 1.71 |
立即询盘 |
Datasheet |
Tube | 8400 | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
8444-21A1-RK-TPCONN SOCKET PLCC 44POS TIN |
8,304 | 2.14 |
立即询盘 |
Datasheet |
Tube | 8400 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
8452-21A1-RK-TPCONN SOCKET PLCC 52POS TIN |
6,893 | 2.24 |
立即询盘 |
Datasheet |
Tube | 8400 | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
8468-21B1-RK-TPCONN SOCKET PLCC 68POS TIN |
8,842 | 2.60 |
立即询盘 |
Datasheet |
Tube | 8400 | Active | PLCC | 68 (4 x 17) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
8484-21B1-RK-TPCONN SOCKET PLCC 84POS TIN |
9,101 | 2.82 |
立即询盘 |
Datasheet |
Tube | 8400 | Active | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 160.0µin (4.06µm) | Copper Alloy | Polybutylene Terephthalate (PBT), Glass Filled |
|
4820-3000-CPCONN IC DIP SOCKET 20POS TIN |
14,203 | 0.79 |
立即询盘 |
Datasheet |
Tube | 4800 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Tin | 35.4µin (0.90µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 35.0µin (0.90µm) | Phosphor Bronze | Polyester, Glass Filled |
|
218-3341-00-0602JCONN IC DIP SOCKET ZIF 18POS GLD |
3,491 | 23.26 |
立即询盘 |
Datasheet |
Tray | Textool™ | Active | DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
|
222-3343-00-0602JCONN IC DIP SOCKET ZIF 22POS GLD |
1,198 | 25.50 |
立即询盘 |
Datasheet |
Tube | Textool™ | Active | DIP, ZIF (ZIP), 0.4 (10.16mm) Row Spacing | 22 (2 x 11) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Connector | Closed Frame | Press-Fit | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Polysulfone (PSU), Glass Filled |
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