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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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346-43-122-41-013000CONN SOCKET SIP 22POS GOLD |
6,687 | 4.38 |
立即询盘 |
Datasheet |
Bulk | 346 | Active | SIP | 22 (1 x 22) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
540-44-084-17-400000CONN SOCKET PLCC 84POS TIN |
2,942 | 4.39 |
立即询盘 |
Datasheet |
Tube | 540 | Obsolete | PLCC | 84 (4 x 21) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 150.0µin (3.81µm) | Copper Alloy | Polyphenylene Sulfide (PPS) |
|
614-93-624-31-012000CONN IC DIP SOCKET 24POS GOLD |
8,003 | 4.40 |
立即询盘 |
Datasheet |
Tube | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
714-43-115-31-018000CONN SOCKET SIP 15POS GOLD |
7,196 | 4.41 |
立即询盘 |
Datasheet |
Bulk | 714 | Active | SIP | 15 (1 x 15) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
117-43-428-41-005000CONN IC DIP SOCKET 28POS GOLD |
7,460 | 4.43 |
立即询盘 |
Datasheet |
Tube | 117 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
714-43-214-31-018000CONN IC DIP SOCKET 14POS GOLD |
9,209 | 4.53 |
立即询盘 |
Datasheet |
Bulk | 714 | Active | DIP, 0.1 (2.54mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
346-93-123-41-013000CONN SOCKET SIP 23POS GOLD |
7,147 | 4.57 |
立即询盘 |
Datasheet |
Bulk | 346 | Active | SIP | 23 (1 x 23) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
346-43-123-41-013000CONN SOCKET SIP 23POS GOLD |
6,672 | 4.57 |
立即询盘 |
Datasheet |
Bulk | 346 | Active | SIP | 23 (1 x 23) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
940-44-044-17-400004CONN SKT PLCC |
5,246 | 4.60 |
立即询盘 |
Datasheet |
Tape & Reel (TR) | 940 | Active | PLCC | 44 (4 x 11) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | - | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) |
|
110-93-318-41-801000CONN IC DIP SOCKET 18POS GOLD |
8,636 | 4.65 |
立即询盘 |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
110-43-318-41-801000CONN IC DIP SOCKET 18POS GOLD |
5,463 | 4.65 |
立即询盘 |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame, Decoupling Capacitor | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
714-43-116-31-018000CONN SOCKET SIP 16POS GOLD |
6,553 | 4.70 |
立即询盘 |
Datasheet |
Bulk | 714 | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
346-93-124-41-013000CONN SOCKET SIP 24POS GOLD |
7,107 | 4.77 |
立即询盘 |
Datasheet |
Tube | 346 | Active | SIP | 24 (1 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
346-43-124-41-013000CONN SOCKET SIP 24POS GOLD |
6,441 | 4.77 |
立即询盘 |
Datasheet |
Bulk | 346 | Active | SIP | 24 (1 x 24) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
614-93-328-31-012000CONN IC DIP SOCKET 28POS GOLD |
7,093 | 4.84 |
立即询盘 |
Datasheet |
Tube | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
940-44-052-17-400004CONN SKT PLCC |
8,202 | 4.86 |
立即询盘 |
Datasheet |
Tape & Reel (TR) | 940 | Active | PLCC | 52 (4 x 13) | 0.050 (1.27mm) | Tin | 150.0µin (3.81µm) | - | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) |
|
123-93-424-41-001000CONN IC DIP SOCKET 24POS GOLD |
9,259 | 4.87 |
立即询盘 |
Datasheet |
Tube | 123 | Active | DIP, 0.4 (10.16mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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|
123-43-624-41-001000CONN IC DIP SOCKET 24POS GOLD |
9,816 | 4.87 |
立即询盘 |
Datasheet |
Tube | 123 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
|
540-44-028-17-400004CONN SKT PLCC |
8,215 | 4.94 |
立即询盘 |
Datasheet |
Tape & Reel (TR) | 540 | Active | PLCC | 28 (4 x 7) | 0.050 (1.27mm) | Tin | 100.0µin (2.54µm) | - | Surface Mount | Closed Frame | Solder | 0.050 (1.27mm) | Tin | 200.0µin (5.08µm) | - | Polyphenylene Sulfide (PPS) |
|
117-43-628-41-005000CONN IC DIP SOCKET 28POS GOLD |
9,432 | 4.96 |
立即询盘 |
Datasheet |
Tube | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.070 (1.78mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
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