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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
211-1-32-006CONN IC DIP SOCKET 32POS GOLD |
5,711 | 2.13 |
立即询盘 |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
NTE435K42SOCKET-42 PIN DIP .070 |
7,230 | 2.14 |
立即询盘 |
Datasheet |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | - | - | - | - | - | - | Solder | 0.100 (2.54mm) | - | - | - | - |
|
211-1-40-006CONN IC DIP SOCKET 40POS GOLD |
9,020 | 2.52 |
立即询盘 |
Datasheet |
Tube | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polybutylene Terephthalate (PBT) |
|
ICF-318-T-OCONN IC DIP SOCKET 18POS TIN |
8,411 | 3.18 |
立即询盘 |
Datasheet |
Tube | iCF | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Liquid Crystal Polymer (LCP) |
|
ICA-628-SGGCONN IC DIP SOCKET 28POS GOLD |
9,993 | 9.57 |
立即询盘 |
Datasheet |
Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled |
|
NTE436W2424-PIN DIP IC SOCKET |
3,643 | 11.35 |
立即询盘 |
Datasheet |
Bulk | - | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | - | - | - | - | Through Hole | - | Wire Wrap | - | - | - | - | - |
|
ICA-640-SGGCONN IC DIP SOCKET 40POS GOLD |
3,655 | 13.09 |
立即询盘 |
Datasheet |
Tube | ICA | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass | Polyester, Glass Filled |
|
APA-316-G-PADAPTER PLUG |
2,348 | 15.64 |
立即询盘 |
Tube | APA | Active | - | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
APA-640-T-BADAPTER PLUG |
3,776 | 15.80 |
立即询盘 |
Bulk | APA | Active | - | 40 (2 x 20) | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
APA-640-G-A1ADAPTER PLUG |
2,835 | 20.29 |
立即询盘 |
Bulk | APA | Active | - | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
APA-640-G-AADAPTER PLUG |
1,850 | 20.75 |
立即询盘 |
Bulk | APA | Active | - | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 20.0µin (0.51µm) | Phosphor Bronze | Polybutylene Terephthalate (PBT), Glass Filled | |
|
346-43-101-41-013000CONN SOCKET SIP 1POS GOLD |
12,640 | 0.29 |
立即询盘 |
Datasheet |
Bulk | 346 | Active | SIP | 1 (1 x 1) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
714-43-101-31-018000CONN SOCKET SIP 1POS GOLD |
11,980 | 0.43 |
立即询盘 |
Datasheet |
Bulk | 714 | Active | SIP | 1 (1 x 1) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
346-93-102-41-013000CONN SOCKET SIP 2POS GOLD |
11,981 | 0.51 |
立即询盘 |
Datasheet |
Bulk | 346 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin-Lead | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
346-43-102-41-013000CONN SOCKET SIP 2POS GOLD |
13,966 | 0.51 |
立即询盘 |
Datasheet |
Bulk | 346 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Press-Fit | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
714-43-204-31-018000CONN IC DIP SOCKET 4POS GOLD |
9,735 | 1.40 |
立即询盘 |
Datasheet |
Bulk | 714 | Active | DIP, 0.1 (2.54mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Carrier, Closed Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
BU14OZ-178-HTCONN IC DIP SOCKET 14POS GOLD |
2,422 | 1.47 |
立即询盘 |
Datasheet |
Tube | BU-178HT | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 78.7µin (2.00µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Copper | Flash | Brass | Polybutylene Terephthalate (PBT), Glass Filled |
|
1571552-2CONN IC DIP SOCKET 8POS TIN |
413 | 1.73 |
立即询盘 |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
110-43-316-10-004000CONN IC DIP SOCKET 16POS GOLD |
8,693 | 1.73 |
立即询盘 |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8), 4 Loaded | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Brass Alloy | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
|
1571586-2CONN IC DIP SOCKET 8POS TIN |
909 | 1.90 |
立即询盘 |
Datasheet |
Tube | 800 | Obsolete | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Tin | - | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Copper | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester |
