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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
01-0508-20CONN SOCKET SIP 1POS GOLD |
13,078 | 0.62 |
立即询盘 |
Datasheet |
Bulk | 508 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
01-0508-30CONN SOCKET SIP 1POS GOLD |
11,849 | 0.62 |
立即询盘 |
Datasheet |
Bulk | 508 | Active | SIP | 1 (1 x 1) | - | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6 |
|
|
02-0513-11CONN SOCKET SIP 2POS GOLD |
12,729 | 0.64 |
立即询盘 |
Datasheet |
Bulk | 0513 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-0518-10HCONN SOCKET SIP 4POS GOLD |
11,192 | 0.64 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-1518-10HCONN IC DIP SOCKET 4POS GOLD |
12,771 | 0.64 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
05-0518-10CONN SOCKET SIP 5POS GOLD |
10,281 | 0.64 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
04-0513-10TCONN SOCKET SIP 4POS GOLD |
13,319 | 0.67 |
立即询盘 |
Datasheet |
Bulk | 0513 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
01-0503-20CONN SOCKET SIP 1POS GOLD |
12,382 | 0.67 |
立即询盘 |
Datasheet |
Bulk | 0503 | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
01-0503-30CONN SOCKET SIP 1POS GOLD |
11,955 | 0.67 |
立即询盘 |
Datasheet |
Bulk | 0503 | Active | SIP | 1 (1 x 1) | - | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | - | Tin | 30.0µin (0.76µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
02-0513-11HCONN SOCKET SIP 2POS GOLD |
13,024 | 0.69 |
立即询盘 |
Datasheet |
Bulk | 0513 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-0513-10CONN SOCKET SIP 4POS GOLD |
10,532 | 0.69 |
立即询盘 |
Datasheet |
Bulk | 0513 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-1518-00CONN IC DIP SOCKET 4POS GOLD |
13,590 | 0.69 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
02-0518-11HCONN SOCKET SIP 2POS GOLD |
11,355 | 0.69 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
02-1518-11HCONN IC DIP SOCKET 2POS GOLD |
11,003 | 0.69 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 2 (1 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-0518-00CONN SOCKET SIP 4POS GOLD |
14,350 | 0.73 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-0518-11CONN SOCKET SIP 4POS GOLD |
10,420 | 0.73 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-1518-11CONN IC DIP SOCKET 4POS GOLD |
14,051 | 0.73 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 4 (2 x 2) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
05-0518-10TCONN SOCKET SIP 5POS GOLD |
13,995 | 0.73 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
05-0518-10HCONN SOCKET SIP 5POS GOLD |
12,213 | 0.76 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 5 (1 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
06-1518-10CONN IC DIP SOCKET 6POS GOLD |
12,853 | 0.76 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
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