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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
22-3503-20

22-3503-20

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

3,830 10.30

立即询盘

22-3503-20

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
22-3503-30

22-3503-30

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

2,692 10.30

立即询盘

22-3503-30

Datasheet

Bulk 503 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
32-6513-10H

32-6513-10H

CONN IC DIP SOCKET 32POS GOLD

Aries Electronics

4,974 10.32

立即询盘

32-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6518-112

40-6518-112

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,791 10.32

立即询盘

40-6518-112

Datasheet

Bulk 518 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
28-6513-11H

28-6513-11H

CONN IC DIP SOCKET 28POS GOLD

Aries Electronics

3,035 10.32

立即询盘

28-6513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-3513-11

30-3513-11

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

2,802 10.35

立即询盘

30-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
38-3513-10H

38-3513-10H

CONN IC DIP SOCKET 38POS GOLD

Aries Electronics

3,905 10.36

立即询盘

38-3513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 38 (2 x 19) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-823-90T

20-823-90T

CONN IC DIP SOCKET 20POS TIN

Aries Electronics

2,121 10.36

立即询盘

20-823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
37-0518-11H

37-0518-11H

CONN SOCKET SIP 37POS GOLD

Aries Electronics

1,892 10.40

立即询盘

37-0518-11H

Datasheet

Bulk 518 Active SIP 37 (1 x 37) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-810-90RWR

14-810-90RWR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

2,095 10.40

立即询盘

14-810-90RWR

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole, Right Angle, Vertical Closed Frame Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-3508-20

18-3508-20

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,800 10.40

立即询盘

18-3508-20

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-3508-30

18-3508-30

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

3,715 10.40

立即询盘

18-3508-30

Datasheet

Bulk 508 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
12-0503-21

12-0503-21

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,176 10.42

立即询盘

12-0503-21

Datasheet

Bulk 0503 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
12-0503-31

12-0503-31

CONN SOCKET SIP 12POS GOLD

Aries Electronics

2,737 10.42

立即询盘

12-0503-31

Datasheet

Bulk 0503 Active SIP 12 (1 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA), Nylon, Glass Filled
25-0508-20

25-0508-20

CONN SOCKET SIP 25POS GOLD

Aries Electronics

2,156 10.42

立即询盘

25-0508-20

Datasheet

Bulk 508 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
25-0508-30

25-0508-30

CONN SOCKET SIP 25POS GOLD

Aries Electronics

1,572 10.42

立即询盘

25-0508-30

Datasheet

Bulk 508 Active SIP 25 (1 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Wire Wrap - Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6
08-0511-11

08-0511-11

CONN SOCKET SIP 8POS GOLD

Aries Electronics

2,988 10.44

立即询盘

08-0511-11

Datasheet

Bulk 511 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-11H

24-3513-11H

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

1,247 10.44

立即询盘

24-3513-11H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6513-10H

40-6513-10H

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

4,274 10.46

立即询盘

40-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
11-71000-10

11-71000-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

4,628 10.46

立即询盘

11-71000-10

Datasheet

Bulk 700 Elevator Strip-Line™ Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
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