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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
39-0518-11

39-0518-11

CONN SOCKET SIP 39POS GOLD

Aries Electronics

8,024 6.85

立即询盘

39-0518-11

Datasheet

Bulk 518 Active SIP 39 (1 x 39) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-3518-111

20-3518-111

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

5,125 6.85

立即询盘

20-3518-111

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-0511-10

10-0511-10

CONN SOCKET SIP 10POS TIN

Aries Electronics

6,553 6.85

立即询盘

10-0511-10

Datasheet

Bulk 511 Active SIP 10 (1 x 10) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-2501-21

08-2501-21

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

7,291 6.95

立即询盘

08-2501-21

Datasheet

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-2501-31

08-2501-31

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

9,287 6.95

立即询盘

08-2501-31

Datasheet

Bulk 501 Active DIP, 0.2 (5.08mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-0501-21

08-0501-21

CONN SOCKET SIP 8POS GOLD

Aries Electronics

9,958 6.98

立即询盘

08-0501-21

Datasheet

Bulk 501 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
50-9518-10

50-9518-10

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

7,248 6.88

立即询盘

50-9518-10

Datasheet

Bulk 518 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
36-6513-10

36-6513-10

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

6,769 6.88

立即询盘

36-6513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
27-0518-00

27-0518-00

CONN SOCKET SIP 27POS GOLD

Aries Electronics

7,099 6.88

立即询盘

27-0518-00

Datasheet

Bulk 518 Active SIP 27 (1 x 27) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Surface Mount Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
23-0518-11H

23-0518-11H

CONN SOCKET SIP 23POS GOLD

Aries Electronics

5,188 6.88

立即询盘

23-0518-11H

Datasheet

Bulk 518 Active SIP 23 (1 x 23) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
30-9513-10

30-9513-10

CONN IC DIP SOCKET 30POS GOLD

Aries Electronics

7,042 6.92

立即询盘

30-9513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.9 (22.86mm) Row Spacing 30 (2 x 15) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3513-11

24-3513-11

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

6,954 6.92

立即询盘

24-3513-11

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-6511-11

08-6511-11

CONN IC DIP SOCKET 8POS GOLD

Aries Electronics

5,883 6.93

立即询盘

08-6511-11

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 8 (2 x 4) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
08-0501-31

08-0501-31

CONN SOCKET SIP 8POS GOLD

Aries Electronics

5,246 6.98

立即询盘

08-0501-31

Datasheet

Bulk 501 Active SIP 8 (1 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Through Hole - Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-6511-10

40-6511-10

CONN IC DIP SOCKET 40POS TIN

Aries Electronics

6,720 6.99

立即询盘

40-6511-10

Datasheet

Bulk 511 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6823-90T

10-6823-90T

CONN IC DIP SOCKET 10POS TIN

Aries Electronics

7,436 6.99

立即询盘

10-6823-90T

Datasheet

Bulk Vertisockets™ 800 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole, Right Angle, Horizontal Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6
18-3501-20

18-3501-20

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

7,020 6.99

立即询盘

18-3501-20

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3501-30

18-3501-30

CONN IC DIP SOCKET 18POS TIN

Aries Electronics

7,794 6.99

立即询盘

18-3501-30

Datasheet

Bulk 501 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Wire Wrap 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
11-0511-10

11-0511-10

CONN SOCKET SIP 11POS TIN

Aries Electronics

7,911 6.99

立即询盘

11-0511-10

Datasheet

Bulk 511 Active SIP 11 (1 x 11) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
40-1518-11

40-1518-11

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

6,173 6.99

立即询盘

40-1518-11

Datasheet

Bulk 518 Active DIP, 0.2 (5.08mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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