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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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18-3518-101CONN IC DIP SOCKET 18POS GOLD |
8,766 | 5.45 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
16-0513-11HCONN SOCKET SIP 16POS GOLD |
5,042 | 5.48 |
立即询盘 |
Datasheet |
Bulk | 0513 | Active | SIP | 16 (1 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | - | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-6518-11CONN IC DIP SOCKET 28POS GOLD |
5,271 | 5.51 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
28-3518-11CONN IC DIP SOCKET 28POS GOLD |
7,190 | 5.51 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
12-3513-11HCONN IC DIP SOCKET 12POS GOLD |
5,202 | 5.53 |
立即询盘 |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
21-0518-00CONN SOCKET SIP 21POS GOLD |
8,641 | 5.53 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 21 (1 x 21) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-1518-11CONN IC DIP SOCKET 30POS GOLD |
7,601 | 5.53 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
44-1518-10CONN IC DIP SOCKET 44POS GOLD |
7,080 | 5.53 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.2 (5.08mm) Row Spacing | 44 (2 x 22) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-0518-11CONN SOCKET SIP 30POS GOLD |
7,596 | 5.55 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 30 (1 x 30) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
37-0518-10HCONN SOCKET SIP 37POS GOLD |
6,742 | 5.55 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | SIP | 37 (1 x 37) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
10-9513-11CONN IC DIP SOCKET 10POS GOLD |
6,326 | 5.58 |
立即询盘 |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.9 (22.86mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
30-3513-10TCONN IC DIP SOCKET 30POS GOLD |
8,292 | 5.58 |
立即询盘 |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.3 (7.62mm) Row Spacing | 30 (2 x 15) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
24-3518-10HCONN IC DIP SOCKET 24POS GOLD |
5,230 | 5.60 |
立即询盘 |
Datasheet |
Bulk | 518 | Active | DIP, 0.3 (7.62mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-6501-20CONN IC DIP SOCKET 10POS TIN |
5,146 | 5.62 |
立即询盘 |
Datasheet |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
10-6501-30CONN IC DIP SOCKET 10POS TIN |
5,604 | 5.62 |
立即询盘 |
Datasheet |
Bulk | 501 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Through Hole | Closed Frame | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
32-6513-10CONN IC DIP SOCKET 32POS GOLD |
8,546 | 5.64 |
立即询盘 |
Datasheet |
Bulk | Lo-PRO®file, 513 | Active | DIP, 0.6 (15.24mm) Row Spacing | 32 (2 x 16) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Closed Frame | Solder | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-0501-21CONN SOCKET SIP 4POS GOLD |
5,950 | 5.65 |
立即询盘 |
Datasheet |
Bulk | 501 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
04-0501-31CONN SOCKET SIP 4POS GOLD |
7,797 | 5.65 |
立即询盘 |
Datasheet |
Bulk | 501 | Active | SIP | 4 (1 x 4) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Phosphor Bronze | Polyamide (PA46), Nylon 4/6, Glass Filled |
|
|
09-0503-20CONN SOCKET SIP 9POS GOLD |
6,137 | 5.65 |
立即询盘 |
Datasheet |
Bulk | 0503 | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
|
|
09-0503-30CONN SOCKET SIP 9POS GOLD |
7,295 | 5.65 |
立即询盘 |
Datasheet |
Bulk | 0503 | Active | SIP | 9 (1 x 9) | 0.100 (2.54mm) | Gold | 30.0µin (0.76µm) | Beryllium Copper | Through Hole | - | Wire Wrap | 0.100 (2.54mm) | Tin | 200.0µin (5.08µm) | Brass | Polyamide (PA), Nylon, Glass Filled |
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