tel:400-966-0015400-966-0015 email:sales@cooltat.com.hksales@cooltat.com.hk 欢迎来到 诺亚方舟半导体(深圳)有限公司
Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































Reset All
Apply All
Results:
图片 型号 库存 价格 数量 规格书 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
31-0518-10T

31-0518-10T

CONN SOCKET SIP 31POS GOLD

Aries Electronics

9,254 3.96

立即询盘

31-0518-10T

Datasheet

Bulk 518 Active SIP 31 (1 x 31) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
34-0518-10

34-0518-10

CONN SOCKET SIP 34POS GOLD

Aries Electronics

8,461 3.96

立即询盘

34-0518-10

Datasheet

Bulk 518 Active SIP 34 (1 x 34) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
22-3513-10

22-3513-10

CONN IC DIP SOCKET 22POS GOLD

Aries Electronics

6,372 3.98

立即询盘

22-3513-10

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.3 (7.62mm) Row Spacing 22 (2 x 11) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-3518-00

24-3518-00

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

6,580 3.98

立即询盘

24-3518-00

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-6513-10

20-6513-10

IC SOCK COLLET CT 20 PIN GOLD

Aries Electronics

5,360 4.00

立即询盘

- 513 Active DIP, 0.6 (15.24mm) Row Spacing 20 (2 x 10) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
24-0513-10

24-0513-10

CONN SOCKET SIP 24POS GOLD

Aries Electronics

8,048 4.00

立即询盘

24-0513-10

Datasheet

Bulk 0513 Active SIP 24 (1 x 24) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-6511-10

10-6511-10

SOCKET 10 POS SOLDER TAIL TIN

Aries Electronics

5,766 4.01

立即询盘

- 511 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
10-6513-10H

10-6513-10H

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

8,842 4.02

立即询盘

10-6513-10H

Datasheet

Bulk Lo-PRO®file, 513 Active DIP, 0.6 (15.24mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
29-0518-10H

29-0518-10H

CONN SOCKET SIP 29POS GOLD

Aries Electronics

7,045 4.02

立即询盘

29-0518-10H

Datasheet

Bulk 518 Active SIP 29 (1 x 29) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
08-0511-10

08-0511-10

CONN SOCKET SIP 8POS TIN

Aries Electronics

7,363 4.03

立即询盘

08-0511-10

Datasheet

Bulk 511 Active SIP 8 (1 x 8) 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Through Hole - Solder 0.100 (2.54mm) Tin 50.0µin (1.27µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
18-3518-10H

18-3518-10H

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

5,717 4.03

立即询盘

18-3518-10H

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-3518-10M

16-3518-10M

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

9,748 4.05

立即询盘

16-3518-10M

Datasheet

Bulk 518 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole Open Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-81000-10WR

14-81000-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

7,103 4.05

立即询盘

14-81000-10WR

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81100-10WR

14-81100-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

6,274 4.05

立即询盘

14-81100-10WR

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81187-10WR

14-81187-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

5,059 4.05

立即询盘

14-81187-10WR

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-81250-10WR

14-81250-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

6,474 4.05

立即询盘

14-81250-10WR

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8260-10WR

14-8260-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

7,193 4.05

立即询盘

14-8260-10WR

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8350-10WR

14-8350-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

6,544 4.05

立即询盘

14-8350-10WR

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8400-10WR

14-8400-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

6,143 4.05

立即询盘

14-8400-10WR

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
14-8435-10WR

14-8435-10WR

CONN IC DIP SOCKET 14POS TIN

Aries Electronics

6,083 4.05

立即询盘

14-8435-10WR

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Phosphor Bronze Polyamide (PA46), Nylon 4/6, Glass Filled
Request a Quote
Part Number
Quantity
Contact
Email
Company
Comments
  • 首页

    首页

    产品展示

    产品展示

    电话

    电话

    联系我们

    联系我们