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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
10-8723-210C

10-8723-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

10,637 0.00

立即询盘

10-8723-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8745-210C

10-8745-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

10,719 0.00

立即询盘

10-8745-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8796-210C

10-8796-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

11,682 0.00

立即询盘

10-8796-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8800-210C

10-8800-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

11,254 0.00

立即询盘

10-8800-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8810-210C

10-8810-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

11,223 0.00

立即询盘

10-8810-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8828-210C

10-8828-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

12,356 0.00

立即询盘

10-8828-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8850-210C

10-8850-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

13,111 0.00

立即询盘

10-8850-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
10-8875-210C

10-8875-210C

CONN IC DIP SOCKET 10POS GOLD

Aries Electronics

13,488 0.00

立即询盘

10-8875-210C

Datasheet

Bulk 8 Active DIP, 0.2 (5.08mm) Row Spacing 10 (2 x 5) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1109565

1109565

SERIES 8XXX ELEV SCKT .300/.600

Aries Electronics

13,105 0.00

立即询盘

1109565

Datasheet

- - Active - - - - - - - - - - - - - -
14-8500-311C

14-8500-311C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

10,062 0.00

立即询盘

14-8500-311C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
14-8500-611C

14-8500-611C

CONN IC DIP SOCKET 14POS GOLD

Aries Electronics

10,996 0.00

立即询盘

14-8500-611C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 14 (2 x 7) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
16-8325-311C

16-8325-311C

CONN IC DIP SOCKET 16POS GOLD

Aries Electronics

14,796 0.00

立即询盘

16-8325-311C

Datasheet

Bulk 8 Active DIP, 0.3 (7.62mm) Row Spacing 16 (2 x 8) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
18-811250-610C

18-811250-610C

CONN IC DIP SOCKET 18POS GOLD

Aries Electronics

10,991 0.00

立即询盘

18-811250-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 18 (2 x 9) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
20-8750-310C

20-8750-310C

CONN IC DIP SOCKET 20POS GOLD

Aries Electronics

10,570 0.00

立即询盘

20-8750-310C

Datasheet

- - Active - - - - - - - - - - - - - -
24-8190-610C

24-8190-610C

CONN IC DIP SOCKET 24POS GOLD

Aries Electronics

14,875 0.00

立即询盘

24-8190-610C

Datasheet

Bulk 8 Active DIP, 0.6 (15.24mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame, Elevated Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
1108883-05

1108883-05

SERIES 0517 PIN-LINE VERTISOCKET

Aries Electronics

12,667 0.00

立即询盘

1108883-05

Datasheet

- - Active - - - - - - - - - - - - - -
181-PGM18041-10

181-PGM18041-10

CONN SOCKET PGA GOLD

Aries Electronics

3,620 0.00

立即询盘

181-PGM18041-10

Datasheet

Bulk PGM Obsolete PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
192-PG17043-10H

192-PG17043-10H

CONN SOCKET PGA GOLD

Aries Electronics

13,712 0.00

立即询盘

192-PG17043-10H

Datasheet

Bulk PG Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
233-PGM18039-51

233-PGM18039-51

CONN SOCKET PGA GOLD

Aries Electronics

10,558 0.00

立即询盘

233-PGM18039-51

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
256-PG16001-10H

256-PG16001-10H

CONN SOCKET PGA GOLD

Aries Electronics

11,656 0.00

立即询盘

256-PG16001-10H

Datasheet

Bulk PG Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
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