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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
64-PRS16016-12

64-PRS16016-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,804 86.38

立即询盘

64-PRS16016-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
101-PLS14030-12

101-PLS14030-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,985 86.43

立即询盘

101-PLS14030-12

Datasheet

Bulk PLS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
101-PRS14030-12

101-PRS14030-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

1,512 86.43

立即询盘

101-PRS14030-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
144-PRS13095-12

144-PRS13095-12

CONN SOCKET PGA ZIF GOLD

Aries Electronics

2,487 87.48

立即询盘

144-PRS13095-12

Datasheet

Bulk PRS Active PGA, ZIF (ZIP) - 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS)
32-6551-18

32-6551-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3,177 118.06

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-6552-18

32-6552-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3,980 118.06

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
32-6553-18

32-6553-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,369 118.06

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
32-3554-18

32-3554-18

CONN IC DIP SOCKET ZIF 32POS

Aries Electronics

3,903 118.06

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 32 (2 x 16) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-6554-18

40-6554-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2,409 140.30

立即询盘

40-6554-18

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-3551-18

40-3551-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2,338 140.30

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-3552-18

40-3552-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

2,460 140.30

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
40-3553-18

40-3553-18

CONN IC DIP SOCKET ZIF 40POS

Aries Electronics

3,287 140.30

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
42-6554-18

42-6554-18

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

3,053 147.15

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
36-3574-18

36-3574-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,406 149.38

立即询盘

36-3574-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-3575-18

36-3575-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,870 149.38

立即询盘

36-3575-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6574-18

36-6574-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

3,133 149.38

立即询盘

36-6574-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
36-6575-18

36-6575-18

CONN IC DIP SOCKET ZIF 36POS TIN

Aries Electronics

2,056 149.38

立即询盘

36-6575-18

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
44-3552-18

44-3552-18

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2,882 154.00

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
44-3553-18

44-3553-18

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2,239 154.00

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
44-6551-18

44-6551-18

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

2,552 154.00

立即询盘

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyetheretherketone (PEEK), Glass Filled
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