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Manufacturer Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
























































































































































































































































































































































































































































































































































































































































































































































































































































































































































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图片 型号 库存 价格 数量 规格书 Packaging Series ProductStatus Type NumberofPositionsorPins(Grid) Pitch-Mating ContactFinish-Mating ContactFinishThickness-Mating ContactMaterial-Mating MountingType Features Termination Pitch-Post ContactFinish-Post ContactFinishThickness-Post ContactMaterial-Post HousingMaterial
28-6552-16

28-6552-16

CONN IC DIP SOCKET ZIF 28POS

Aries Electronics

4,246 52.80

立即询盘

28-6552-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 28 (2 x 14) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
28-3554-16

28-3554-16

CONN IC DIP SOCKET ZIF 24POS

Aries Electronics

4,210 52.80

立即询盘

28-3554-16

Datasheet

Bulk 55 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 24 (2 x 12) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
132-PGM13038-50

132-PGM13038-50

CONN SOCKET PGA GOLD

Aries Electronics

4,772 53.57

立即询盘

- PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
50-9508-21

50-9508-21

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

3,912 54.62

立即询盘

50-9508-21

Datasheet

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
50-9508-31

50-9508-31

CONN IC DIP SOCKET 50POS GOLD

Aries Electronics

4,169 54.62

立即询盘

50-9508-31

Datasheet

Bulk 508 Active DIP, 0.9 (22.86mm) Row Spacing 50 (2 x 25) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Wire Wrap 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
44-3573-16

44-3573-16

CONN IC DIP SOCKET ZIF 44POS

Aries Electronics

1,826 55.19

立即询盘

44-3573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 44 (2 x 22) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
36-6556-41

36-6556-41

CONN IC DIP SOCKET 36POS GOLD

Aries Electronics

3,865 55.34

立即询盘

36-6556-41

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 36 (2 x 18) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
121-PGM13012-10T

121-PGM13012-10T

CONN SOCKET PGA TIN

Aries Electronics

1,721 55.53

立即询盘

121-PGM13012-10T

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
281-PGM18037-11

281-PGM18037-11

CONN SOCKET PGA GOLD

Aries Electronics

4,009 55.55

立即询盘

281-PGM18037-11

Datasheet

Bulk PGM Active PGA - 0.100 (2.54mm) Gold 10.0µin (0.25µm) Beryllium Copper Through Hole - Solder 0.100 (2.54mm) Gold 10.0µin (0.25µm) Brass Polyamide (PA46), Nylon 4/6, Glass Filled
40-6556-40

40-6556-40

CONN IC DIP SOCKET 40POS GOLD

Aries Electronics

3,316 55.79

立即询盘

40-6556-40

Datasheet

Bulk 6556 Active DIP, 0.6 (15.24mm) Row Spacing 40 (2 x 20) 0.100 (2.54mm) Gold 30.0µin (0.76µm) Beryllium Copper Through Hole Open Frame Solder Cup 0.100 (2.54mm) Tin 200.0µin (5.08µm) Brass Polyphenylene Sulfide (PPS), Glass Filled
42-6574-16

42-6574-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

1,054 55.97

立即询盘

42-6574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3570-16

42-3570-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

1,071 55.98

立即询盘

42-3570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-3571-16

42-3571-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

1,193 55.98

立即询盘

42-3571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-3572-16

42-3572-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

1,752 55.98

立即询盘

42-3572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-3573-16

42-3573-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

4,180 55.98

立即询盘

42-3573-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-3574-16

42-3574-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

2,645 55.98

立即询盘

42-3574-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-3575-16

42-3575-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3,688 55.98

立即询盘

42-3575-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
42-6570-16

42-6570-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

1,503 55.98

立即询盘

42-6570-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-6571-16

42-6571-16

CONN IC DIP SOCKET ZIF 42POS

Aries Electronics

3,450 55.98

立即询盘

42-6571-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Through Hole Closed Frame Solder 0.100 (2.54mm) Nickel Boron 50.0µin (1.27µm) Beryllium Nickel Polyphenylene Sulfide (PPS), Glass Filled
42-6572-16

42-6572-16

CONN IC DIP SOCKET ZIF 42POS TIN

Aries Electronics

3,744 55.98

立即询盘

42-6572-16

Datasheet

Bulk 57 Active DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 42 (2 x 21) 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Through Hole Closed Frame Solder 0.100 (2.54mm) Tin 200.0µin (5.08µm) Beryllium Copper Polyphenylene Sulfide (PPS), Glass Filled
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