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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-83-648-41-001101CONN IC DIP SOCKET 48POS GOLD |
7,905 | 2.81 |
立即询盘 |
Datasheet |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-83-648-41-001151CONN IC DIP SOCKET 48POS GOLD |
9,183 | 2.81 |
立即询盘 |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
116-87-642-41-018101CONN IC DIP SOCKET 42POS GOLD |
6,285 | 2.81 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-648-41-105101CONN IC DIP SOCKET 48POS GOLD |
9,488 | 2.82 |
立即询盘 |
Datasheet |
Bulk | 110 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-87-648-41-001101CONN IC DIP SOCKET 48POS GOLD |
8,583 | 2.82 |
立即询盘 |
Datasheet |
Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 48 (2 x 24) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-624-41-002101CONN IC DIP SOCKET 24POS GOLD |
6,514 | 2.84 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-640-41-003101CONN IC DIP SOCKET 40POS GOLD |
9,213 | 2.84 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
299-87-318-11-001101CONN IC DIP SOCKET 18POS GOLD |
6,524 | 2.84 |
立即询盘 |
Datasheet |
Bulk | 299 | Active | DIP, 0.3 (7.62mm) Row Spacing | 18 (2 x 9) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-87-964-41-001101CONN IC DIP SOCKET 64POS GOLD |
9,983 | 2.84 |
立即询盘 |
Datasheet |
Bulk | 110 | Active | DIP, 0.9 (22.86mm) Row Spacing | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
117-83-652-41-005101CONN IC DIP SOCKET 52POS GOLD |
8,243 | 3.46 |
立即询盘 |
Datasheet |
Bulk | 117 | Active | DIP, 0.6 (15.24mm) Row Spacing | 52 (2 x 26) | 0.070 (1.78mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.070 (1.78mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-650-41-006101CONN IC DIP SOCKET 50POS GOLD |
6,632 | 3.25 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-068-10-001101CONN SOCKET PGA 68POS GOLD |
8,433 | 3.15 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-640-41-001101CONN IC DIP SOCKET 40POS GOLD |
9,712 | 3.30 |
立即询盘 |
Datasheet |
Bulk | 614 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-628-41-002101CONN IC DIP SOCKET 28POS GOLD |
6,562 | 3.41 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-428-41-002101CONN IC DIP SOCKET 28POS GOLD |
8,676 | 3.31 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-624-41-001101CONN IC DIP SOCKET 24POS GOLD |
8,694 | 3.31 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 24 (2 x 12) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-83-428-41-105101CONN IC DIP SOCKET 28POS GOLD |
6,137 | 3.14 |
立即询盘 |
Datasheet |
Bulk | 110 | Active | DIP, 0.4 (10.16mm) Row Spacing | 28 (2 x 14) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
114-83-642-41-117101CONN IC DIP SOCKET 42POS GOLD |
9,268 | 2.88 |
立即询盘 |
Datasheet |
Bulk | 114 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
114-83-642-41-134161CONN IC DIP SOCKET 42POS GOLD |
7,091 | 2.88 |
立即询盘 |
Datasheet |
Bulk | 114 | Active | DIP, 0.6 (15.24mm) Row Spacing | 42 (2 x 21) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-064-01-505101CONN IC DIP SOCKET 64POS GOLD |
8,421 | 2.98 |
立即询盘 |
Datasheet |
Bulk | 110 | Active | - | 64 (2 x 32) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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