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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
614-87-088-13-081112CONN SOCKET PGA 88POS GOLD |
9,372 | 9.32 |
立即询盘 |
Datasheet |
Bulk | 614 | Active | PGA | 88 (13 x 13) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-87-309-21-001101CONN SOCKET PGA 309POS GOLD |
5,694 | 9.32 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 309 (21 x 21) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-201-15-041101CONN SOCKET PGA 201POS GOLD |
5,353 | 9.32 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 201 (15 x 15) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
299-87-640-10-002101CONN IC DIP SOCKET 40POS GOLD |
8,512 | 9.36 |
立即询盘 |
Datasheet |
Bulk | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-068-10-061101PGA SOLDER TAIL |
7,211 | 9.38 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | PGA | 68 (10 x 10) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-068-11-061101PGA SOLDER TAIL |
7,418 | 9.38 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-068-11-071101PGA SOLDER TAIL |
5,454 | 9.38 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | PGA | 68 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-207-17-081101CONN SOCKET PGA 207POS GOLD |
8,621 | 9.60 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 207 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-650-41-004101CONN IC DIP SOCKET 50POS GOLD |
6,896 | 9.46 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 50 (2 x 25) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-069-11-001101PGA SOLDER TAIL |
8,168 | 9.52 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | PGA | 69 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
550-10-069-11-061101PGA SOLDER TAIL |
9,457 | 9.52 |
立即询盘 |
Datasheet |
Bulk | 550 | Active | PGA | 69 (11 x 11) | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Gold | 10.0µin (0.25µm) | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-207-17-082101CONN SOCKET PGA 207POS GOLD |
7,325 | 9.60 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 207 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-208-17-081101CONN SOCKET PGA 208POS GOLD |
8,156 | 9.65 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 208 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-209-17-001101CONN SOCKET PGA 209POS GOLD |
8,702 | 9.69 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 209 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-209-17-062101CONN SOCKET PGA 209POS GOLD |
9,044 | 9.69 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 209 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-209-17-063101CONN SOCKET PGA 209POS GOLD |
9,113 | 9.69 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 209 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-209-17-081101CONN SOCKET PGA 209POS GOLD |
8,434 | 9.69 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 209 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-83-640-41-013101CONN IC DIP SOCKET 40POS GOLD |
9,833 | 9.76 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 40 (2 x 20) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
299-83-636-10-002101CONN IC DIP SOCKET 36POS GOLD |
8,862 | 9.77 |
立即询盘 |
Datasheet |
Bulk | 299 | Active | DIP, 0.6 (15.24mm) Row Spacing | 36 (2 x 18) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole, Right Angle, Horizontal | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
510-83-210-17-061101CONN SOCKET PGA 210POS GOLD |
7,470 | 9.74 |
立即询盘 |
Datasheet |
Bulk | 510 | Active | PGA | 210 (17 x 17) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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