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| 图片 | 型号 | 库存 | 价格 | 数量 | 规格书 | Packaging | Series | ProductStatus | Type | NumberofPositionsorPins(Grid) | Pitch-Mating | ContactFinish-Mating | ContactFinishThickness-Mating | ContactMaterial-Mating | MountingType | Features | Termination | Pitch-Post | ContactFinish-Post | ContactFinishThickness-Post | ContactMaterial-Post | HousingMaterial |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
110-83-210-41-005101CONN IC DIP SOCKET 10POS GOLD |
14,721 | 0.53 |
立即询盘 |
Datasheet |
Bulk | 110 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-83-310-41-005101CONN IC DIP SOCKET 10POS GOLD |
11,737 | 0.55 |
立即询盘 |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
110-87-320-41-001101CONN IC DIP SOCKET 20POS GOLD |
14,936 | 0.56 |
立即询盘 |
Datasheet |
Tube | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-87-320-41-001151CONN IC DIP SOCKET 20POS GOLD |
14,403 | 0.56 |
立即询盘 |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 20 (2 x 10) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Open Frame, No Center Bar | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
110-87-310-41-105161CONN IC DIP SOCKET 10POS GOLD |
12,208 | 0.54 |
立即询盘 |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-310-41-006101CONN IC DIP SOCKET 10POS GOLD |
12,831 | 0.54 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-610-41-006101CONN IC DIP SOCKET 10POS GOLD |
12,531 | 0.56 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.6 (15.24mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-308-41-001101CONN IC DIP SOCKET 8POS GOLD |
14,161 | 0.54 |
立即询盘 |
Datasheet |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
115-83-210-41-001101CONN IC DIP SOCKET 10POS GOLD |
13,213 | 0.55 |
立即询盘 |
Bulk | 115 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
116-87-210-41-007101CONN IC DIP SOCKET 10POS GOLD |
13,581 | 0.97 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.2 (5.08mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-316-41-003101CONN IC DIP SOCKET 16POS GOLD |
13,270 | 0.97 |
立即询盘 |
Datasheet |
Tube | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-312-31-012101CONN IC DIP SOCKET 12POS GOLD |
10,606 | 0.94 |
立即询盘 |
Datasheet |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 12 (2 x 6) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
115-83-316-41-003101CONN IC DIP SOCKET 16POS GOLD |
13,221 | 0.94 |
立即询盘 |
Datasheet |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 16 (2 x 8) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
116-87-308-41-004101CONN IC DIP SOCKET 8POS GOLD |
14,286 | 0.95 |
立即询盘 |
Datasheet |
Bulk | 116 | Active | DIP, 0.3 (7.62mm) Row Spacing | 8 (2 x 4) | 0.100 (2.54mm) | Gold | Flash | Beryllium Copper | Through Hole | Elevated, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
614-83-314-41-001101CONN IC DIP SOCKET 14POS GOLD |
11,770 | 0.95 |
立即询盘 |
Datasheet |
Bulk | 614 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Carrier, Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
110-83-314-41-105101CONN IC DIP SOCKET 14POS GOLD |
10,991 | 0.96 |
立即询盘 |
Datasheet |
Bulk | 110 | Active | DIP, 0.3 (7.62mm) Row Spacing | 14 (2 x 7) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Surface Mount | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
|
540-88-020-17-400-TRCONN SOCKET PLCC 20POS TIN |
14,647 | 0.99 |
立即询盘 |
Datasheet |
Tape & Reel (TR) | 540 | Active | PLCC | 20 (4 x 5) | 0.050 (1.27mm) | Tin | - | Phosphor Bronze | Surface Mount | Closed Frame | Solder | 0.100 (2.54mm) | Tin | - | Phosphor Bronze | Polyphenylene Sulfide (PPS) |
|
115-83-310-41-001101CONN IC DIP SOCKET 10POS GOLD |
10,260 | 0.57 |
立即询盘 |
Bulk | 115 | Active | DIP, 0.3 (7.62mm) Row Spacing | 10 (2 x 5) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Solder | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled | |
|
121-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
12,361 | 0.55 |
立即询盘 |
Datasheet |
Bulk | 121 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
|
122-83-306-41-001101CONN IC DIP SOCKET 6POS GOLD |
11,027 | 0.61 |
立即询盘 |
Datasheet |
Bulk | 122 | Active | DIP, 0.3 (7.62mm) Row Spacing | 6 (2 x 3) | 0.100 (2.54mm) | Gold | 29.5µin (0.75µm) | Beryllium Copper | Through Hole | Open Frame | Wire Wrap | 0.100 (2.54mm) | Tin | - | Brass | Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled |
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